Indispensable Tool for Materials Analysis
Confocal Laser Scanning Microscopy (CLSM) is a optical 3-dimensional (3D) surface profilerwith a high-resolution. With a high numerical aperture objective lens (up to 0.95) and a shorterwavelength laser provide a high-resolution imaging along both the optical and transversedirection. A confocal pinhole also improves the imaging quality by rejecting the noise outsidethe focal point. Real time imaging is achieved by a fast scanning module and a signal processing algorithm. It takes less than 1 second to get the 3D surface profile of the sample.CLSM is a non-destructive high-resolution optical 3D surface profiler for the micro-structure. It is an ideal solution to measure and inspect the semiconductor wafers, FPD products, MEMS devices, glass surfaces, and material surfaces.
Confocal Laser Scanning Microscopy (CLSM) is a optical 3-dimensional (3D) surface profilerwith a high-resolution. With a high numerical aperture objective lens (up to 0.95) and a shorterwavelength laser provide a high-resolution imaging along both the optical and transversedirection. A confocal pinhole also improves the imaging quality by rejecting the noise outsidethe focal point. Real time imaging is achieved by a fast scanning module and a signal processing algorithm. It takes less than 1 second to get the 3D surface profile of the sample.CLSM is a non-destructive high-resolution optical 3D surface profiler for the micro-structure. It is an ideal solution to measure and inspect the semiconductor wafers, FPD products, MEMS devices, glass surfaces, and material surfaces.
The height measuring ability comes from the confocal setup of a source, a sample, and a detector. When the sample is located in the focal plane of the objective lens, the light reflected at the surface of the sample is focused at the confocal aperture thus the photodetector collects the signal from the sample. However the sample is placed in the out-of-focus position, the light signal is rejected by the confocl aperture. Thus only the in-focus signal is collected by the photo detector. It gives the optical sectioning ability to the CLSM. To get the 3D surface profile of the sample, optical sections are collected through the z-axis. Due to the confocal aperture, the light intensity is maximum when the sample is placed in the focal plane.
Maximum intensity is detected at the focal plane. The intensity decreases when the sample is away from the focal plane. To find the maximum intensity precisely, multi-points near the maximum position are used for the curve fitting. This provides high repeatability onmeasuring the height. The height is calculated by the curve fitting at every pixel. This height map shows the surface profile of the sample.A CLSM has many applications in the industrial fields since it is fast, nondestructive, and reliable 3D surface profiler. It can measure 3D shape, step height and volume of the micro structures. The LCD panels, semiconductor wafers, MEMS devices, material surfaces, andeven transparent glass surfaces can be measured and inspected. Moreover, a CLSM iswidely used for the biological researches. With a fluorescent die it can get a clear image of biological specimens from its own nature. 3D structure and dynamics of the cells also can bemeasured. Since a CLSM can observe the tissues under the skin it is applied to skin cancerdetection. Recently, confocal endoscope system has been introduced for the sub-micron gastrointestinal examinations.
High-speed confocal 3D profiler
NS-3000 is a high-speed confocal laser scanning microscope for precise and reliable 3D measurement.A real time confocal zmicroscopic image is achieved by fast opticalscanning modules and signal processing algorithms. It is a promising solution to measure and inspect the microscopic 3D structures such as semiconductor wafers, FPDproducts, MEMS devices, glass substrates,and material surfaces.
NS-3000 is a high-speed confocal laser scanning microscope for precise and reliable 3D measurement.A real time confocal zmicroscopic image is achieved by fast opticalscanning modules and signal processing algorithms. It is a promising solution to measure and inspect the microscopic 3D structures such as semiconductor wafers, FPDproducts, MEMS devices, glass substrates,and material surfaces.
Major Features
High resolution nondestructive optical 3D measurement
- Real time confocal imaging- Various optical zoom
- Simultaneous brightfield and confocal imaging
- Automatic gain search with fine auto focus
- Inclination compensation - Easy analysis mode
- Precise and reliable high-speed height measurement
- Inspection of features through semi-transparent substrate
- No sample preparationApplications : Surface Measurement and Inspection NS-3000 is designed for the measurement of HEIGHT, WIDTH, ANGLE, AREA and VOLUME of micro and submicro structures such as- Semiconductor
- IC pattern, bump hight, defect inspection, CMP process
- FPD products
- LCD column spacer height, PDP rib height, coating inspection
- MEMS devices
- 3D profile of structure, surface roughness, MEMS pattern- Glass surfaces
- Thin film solar cell, laser patterning, scratch depth- Material Researches
- Tooling surface inspection, roughness, crack analysis.
contact: sem.jeong@gmail.com
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